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Digital computation allows the direct, error tree, display of sheet resistivity in ohm/square from 1.1 Mohm/sq to 450 kohm/sq, slice resistivity in ohm-centimeters from 4.19 x 10-2 Mohm-cm to 17.1 kohm-cm, V/I in ohms from 0.25 Mohm to 99.9 kohm or metallization thickness in kilo angstroms from 20 A to 243 KA. Use of graphs, tables or mechanical calculations and other associated errors are totally eliminated.
Operator simply places water on molded water carrier, and closes RFI/light shield to initiate test. Unit automatically ranges to correct range and displays correct reading including decimal point and multiplier and water type simultaneously. Reading is held to assist in data logging until next test is initiated.
Convenient plug in probe head adapter assembly permits changing or replacing of worn probe heads in minutes without special tools or alignment fixtures. Alessi probe heads are provided as standard equipment. K&S heads are optional.
The FPP-5000 utilizes a probe up configuration. This probe up technique assures repeatable probe pressure at every test independent of operator force and substrate thickness.
The probe tips remain below the stage of the FPP-5000 until the cover is lowered, eliminating damage to the water. Probe tips are not powered until after contact with the wafer to eliminate arcing with consequent probe tip erosion and wafer pitting.
Cast aluminum RFI/light shield eliminates problems due to radio frequency noise and photoelectric effects when measuring high resistivity layers.
Test results are displayed on a direct five digit LED display.
Built-in penetration function applies a 170V, 4 msec pulse to probes through a 10 Mohm resistance prior to test for low contact resistance if desired. Penetrate function is front panel selected.
Automatic type testing (P-N) is determined by a rectification or thermoelectric test. The substrate type will be indicated by illumination of either the P or N indicator. Invalid or questionable tests are indicated by illumination of both indicators.
Automatic forward and reverse current test for instant verification of proper probe tip contact.
Total test time less than 2 seconds.
±0.5% on all but extreme ranges for contact resistances up to 5 kohm. Automatic zero circuit minimizes thermal and source impedance effects and eliminates need to manually readjust instrument zero. The self calibration and zero circuitry assures high accuracy.
Input impedance 10 Mohm. Input bias current 5O pA.
The microprocessor based electronics employ state of the art components for trouble free operation and high reliability. All electronic components are mounted on easily replaced printed circuit boards. Operation and maintenance manuals are included.
15°C to 30°C
115/230 volts, 50/60 Hz. Less than 12 Watts.
15" wide, 16" deep, 5" high (lid closed,) 15" high (lid open.)
Fragment Carrier and One Wafer Carrier
| Application for Probe Head Assembly | Pressure gm/pin | Tip Radii mils | Part No. |
|---|---|---|---|
| Standard for Si slices and ingots | 70-180 | 2.0 | 8295-239-01 |
| Epilayers <1µ thick, resistance >1 Mohm | 40-70 | 2.0 | 8295-239-03 |
| Epilayers <1µ thick, resistance <1 Mohm | 40-70 | 5.0 | 8295-239-05 |
| Metallization layers | 40-70 | 10.0 | 8295-239-07 |
Use the above part number or a custom ordering code: SP/RM
Spacing
Pressure
Radii
Material
One year warranty, except probe head, which is a consumable item.