Veeco FPP-5000 Functions

The VEECO FPP-5000 4-point probe simplifies the measurement of resistive properties of semiconductor wafers and resistive films. The microprocessor based electronics permits direct computation of V/I, sheet or slice resistivity, and metallization thickness and P-N type testing. Unlike most four point probes and probing stations, which move the probe head into the wafer, the FPP-5000 is designed so that the wafer is moved into the probe head. This insures constant probe force independent of operator force and wafer thickness.

Keyboard Description

V/I - Displays measured V/I multiplied by programmed GEOM Constant.
SHEET - Displays sheet resistance based on measured V/I.
SLICE - Calculates the bulk resistivity of a slice of layer whose thickness is entered in the PRGM mode.
THICK - Calculates the thickness of a layer of slices whose bulk resistivity is entered in the PRGM mode.
TYPE - When selected, a type test is performed.
PEN - When selected, a penetrate voltage is applied to the sample.
PRGM - Put the keyboard into the PRGM mode for entering bulk resistivity or film thickness. Press STORE afterwards to store the input into system memory.
SELF-TEST - Performs a system self test.
RETEST - Performs a retest when the previous test failed.
CONST - Displays the selected input stored in the memory.
Numerical Keys - To enter the input required for calculation.

Measurement Procedures

Enable 4ptprb on the WAND (required for this automatic tool).
Press CLEAR to clear any error message on the display.
Select desired function. Select SHEET for sheet resistance measurement.
Place the wafer face down in the wafer holder (4"/6").
Place the backing plate with the spiral side facing towards your wafer.
Open the cover, and put the wafer holder, with the wafer facing down, onto the platen.
Close the cover and hold it down to start a test. When the measurement is done, the result will be displayed. E02 error will appear on the display if the cover is released before the measurement is completed.